Axeme - Hwaling Technology Co., Ltd.

Hwaling Technology is based in Taipei, Taiwan. As the interaction of Communication, Electronic Consumer and Computing gadgets has became the main stream in consumer lives. Hwaling practices his specialty with long-term experience in this memory field to drive quality products and services to customers.

LPDDR4 SDRAM

Axeme - Hwaling Technology Co., Ltd. is a national manufacturer and supplier that specialize in providing of LPDDR4 SDRAM related products. Our goal is to build a long term relationship as your LPDDR4 SDRAM supplier by providing quality products and service that exceeds your expectations. As one of the leading manufacturers of DRAM IC we can manufacture LPDDR4 SDRAM that meets specific technical requirements. If you need more information about LPDDR4 SDRAM, please just drop us a line or give us a call.
Item No. Product Name Density Organization Voltage Package File Download
H2AB04G32D6C LPDDR4 SDRAM 4Gb 128Mb x 32 1.8 / 1.1 / 1.1V FBGA-200 H2AB04G32D6C_Low-Power-DDR4_128Mx32 (996 KB)
H2AB08G32D6C LPDDR4 SDRAM 8Gb 256Mb x 32 1.8 / 1.1 / 1.1V FBGA-200 H2AB08G32D6C_Low-Power-DDR4_256Mx32 (1009 KB)
H2AB16G32D6C LPDDR4 SDRAM 16Gb 512Mb x 32 1.8 / 1.1 / 1.1V FBGA-200 H2AB16G32D6C_Low-Power-DDR4_512Mx32 (1023 KB)
H2AB32G32D6C LPDDR4 SDRAM 32Gb 1024Mb x 32 1.8 / 1.1 / 1.1V FBGA-200 H2AB32G32D6C_Low-Power-DDR4_1024Mx32 (1015 KB)
H2AB32G64D6C LPDDR4 SDRAM 32Gb 512Mb x 64 1.8 / 1.1 / 1.1V FBGA-366 H2AB32G64D6C_Low-Power-DDR4_512Mx64 (1011 KB)
H2AB16G32E6C LPDDR4X SDRAM 16Gb 512Mb x 32 1.8 / 1.1 / 0.6V FBGA-200 H2AB16G32E6C_Low-Power-DDR4_1024Mx32 (993 KB)

H2AB04G32D6C

4Gb (16Mx8Banks×32) Low Power DDR4 SDRAM

H2AB04G32D6C uses the double data rate architecture on the Command/Address (CA) bus to reduce the number of input pins in the system. Each command uses one clock cycle,during which command information is transferred on both the positive and negative edge of the clock. To achieve high-speed operation, our H2AB04G32D6C SDRAM adopt 16n-prefetch interface designed to transfer two data per clock cycle at the I/O pins. A single read or write access for the H2AB04G32D6C effectively consists of a single 8n-bit wide, one clock cycle data transfer at the internal SDRAM core and eight corresponding n-bit wide,one-half-clock-cycle data transfer at the I/O pins. Read and write accesses to the H2AB04G32D6C are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence.

For H2AB04G32D6C devices, accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address and BA bits registered coincident with the Active command are used to select the row and the Bank to be accessed. The address bits registered coincident with the Read or Write command are used to select the Bank and the starting column location for the burst access.

H2AB08G32D6C

8Gb (32Mx8Banks×32) Low Power DDR4 SDRAM

H2AB08G32D6C uses the double data rate architecture on the Command/Address (CA) bus to reduce the number of input pins in the system. Each command uses one clock cycle,during which command information is transferred on both the positive and negative edge of the clock. To achieve high-speed operation, our H2AB08G32D6C SDRAM adopt 16n-prefetch interface designed to transfer two data per clock cycle at the I/O pins. A single read or write access for the H2AB08G32D6C effectively consists of a single 8n-bit wide, one clock cycle data transfer at the internal SDRAM core and eight corresponding n-bit wide,one-half-clock-cycle data transfer at the I/O pins. Read and write accesses to the H2AB08G32D6C are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence.

For H2AB08G32D6C devices, accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address and BA bits registered coincident with the Active command are used to select the row and the Bank to be accessed. The address bits registered coincident with the Read or Write command are used to select the Bank and the starting column location for the burst access.

H2AB16G32D6C

16Gb (64Mx8Banks×32) Low Power DDR4 SDRAM

H2AB16G32D6C uses the double data rate architecture on the Command/Address (CA) bus to reduce the number of input pins in the system. Each command uses one clock cycle,during which command information is transferred on both the positive and negative edge of the clock. To achieve high-speed operation, our H2AB16G32D6C SDRAM adopt 16n-prefetch interface designed to transfer two data per clock cycle at the I/O pins. A single read or write access for the H2AB16G32D6C effectively consists of a single 8n-bit wide, one clock cycle data transfer at the internal SDRAM core and eight corresponding n-bit wide,one-half-clock-cycle data transfer at the I/O pins. Read and write accesses to the H2AB16G32D6C are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence.

For H2AB16G32D6C devices, accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address and BA bits registered coincident with the Active command are used to select the row and the Bank to be accessed. The address bits registered coincident with the Read or Write command are used to select the Bank and the starting column location for the burst access.

H2AB32G32D6C

32Gb (128Mx8Banks×32) Low Power DDR4 SDRAM

H2AB32G32D6C uses the double data rate architecture on the Command/Address (CA) bus to reduce the number of input pins in the system. Each command uses one clock cycle,during which command information is transferred on both the positive and negative edge of the clock. To achieve high-speed operation,our H2AB32G32D6C SDRAM adopt 16n-prefetch interface designed to transfer two data per clock cycle at the I/O pins. A single read or write access for the H2AB32G32D6C effectively consists of a single 8n-bit wide, one clock cycle data transfer
at the internal SDRAM core and eight corresponding n-bit wide,one-half-clock-cycle data transfer at the I/O pins. Read and write accesses to the H2AB32G32D6C are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence.

For H2AB32G32D6C devices, accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address and BA bits registered coincident with the Active command are used to select the row and the Bank to be accessed. The address bits registered coincident with the Read or Write command are used to select the Bank and the starting column location for the burst access.

H2AB32G64D6C

32Gb (64Mx8Banks×64) Low Power DDR4 SDRAM

H2AB32G64D6C uses the double data rate architecture on the Command/Address (CA) bus to reduce the number of input pins in the system. Each command uses one clock cycle,during which command information is transferred on both the positive and negative edge of the clock. To achieve high-speed operation, our H2AB32G64D6C SDRAM adopt 16n-prefetch interface designed to transfer two data per clock cycle at the I/O pins. A single read or write access for the H2AB32G64D6C effectively consists of a single 8n-bit wide, one clock cycle data transfer at the internal SDRAM core and eight corresponding n-bit wide,one-half-clock-cycle data transfer at the I/O pins. Read and write accesses to the H2AB32G64D6C are burst oriented; accesses start at a selected location
and continue for a programmed number of locations in a programmed sequence.

For H2AB32G64D6C devices, accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address and BA bits registered coincident with the Active command are used to select the row and the Bank to be accessed. The address bits registered coincident with the Read or Write command are used to select the Bank and the starting column location for the burst access.

H2AB16G32E6C

16Gb (512Meg×32) Low Power DDR4 SDRAM

H2AB16G32E6C uses the double data rate architecture on the Command/Address (CA) bus to reduce the number of input pins in the system. Each command uses one clock cycle,during which command information is transferred on both the positive and negative edge of the clock. To achieve high-speed operation, our H2AB16G32E6C SDRAM adopt 16n-prefetch interface designed to transfer two data per clock cycle at the I/O pins.

A single read or write access for the H2AB16G32E6C effectively consists of a single 8n-bit wide, one clock cycle data transfer at the internal SDRAM core and eight corresponding n-bit wide,one-half-clock-cycle data transfer at the I/O pins. Read and write accesses to the H2AB16G32E6C are burst oriented; accesses start at a selected location and continue for a programmed number of locations in a programmed sequence. For H2AB16G32E6C devices, accesses begin with the registration of an Active command, which is then followed by a Read or Write command. The address and BA bits registered coincident with the Active command are used to select the row and the Bank to be accessed. The address bits registered coincident with the Read or Write command are used to select the Bank and the starting column location for the burst access.
Axeme - Hwaling Technology Co., Ltd. encourages customers to contact us about feedback, comments, and questions. We promise that we will reply to you as soon as possible. All our LPDDR4 SDRAM is developed by a creative team of professionals as per contemporary market trends. With our expertise, we have been offering quality LPDDR4 SDRAM renowned for premium features at competitive prices. If you are unable to find LPDDR4 SDRAM you desire let us know, and we will endeavor to satisfy your requirements within the shortest possible timescale.