H2A402G1666P
2Gb (16Mx8Banksx16) DDR3 SDRAM
The H2A402G1666P is a high speed Double Date Rate 3 (DDR3) low voltage Synchronous DRAM fabricated with ultra high performance CMOS process containing 2,147,483,648 bits which organized as 16Mbits x 8 banks by 16 bits.
This synchronous device achieves high speed double-data-rate transfer rates of up to 1866 Mb/sec/pin (DDR3-1866) for general applications.
The chip is designed to comply with the following key DDR3 SDRAM features:
Inputs are latched at the cross point of differential clocks (CK rising and /CK falling).
All I/Os are synchronized with a pair of bidirectional differential data strobes (DQS and /DQS) in a source synchronous fashion.
The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 2Gb DDR3 devices operates with a single power supply: 1.5V±0.075V VDD and VDDQ.
This synchronous device achieves high speed double-data-rate transfer rates of up to 1866 Mb/sec/pin (DDR3-1866) for general applications.
The chip is designed to comply with the following key DDR3 SDRAM features:
- posted CAS with additive latency
- write latency = read latency -1
- On Die Termination
- programmable driver strength data
- seamless BL4 access with bank-grouping
Inputs are latched at the cross point of differential clocks (CK rising and /CK falling).
All I/Os are synchronized with a pair of bidirectional differential data strobes (DQS and /DQS) in a source synchronous fashion.
The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 2Gb DDR3 devices operates with a single power supply: 1.5V±0.075V VDD and VDDQ.
Features
- JEDEC Standard VDD/VDDQ = 1.5V±0.075V
- All inputs and outputs are compatible with SSTL_15 interface.
- Fully differential clock inputs (CK, /CK) operation.
- Eight Banks
- Posted CAS by programmable additive latency
- Bust length: 4 with Burst Chop (BC) and 8.
- CAS Write Latency (CWL): 5, 6, 7, 8
- CAS Latency (CL): 6, 7, 8, 9, 10, 11,13
- Write Latency (WL) =Read Latency (RL) -1.
- Bi-directional Differential Data Strobe (DQS).
- Data inputs on DQS centers when write.
- Data outputs on DQS, /DQS edges when read.
- On chip DLL align DQ, DQS and /DQS transition with CK transition.
- DM mask write data-in at the both rising and falling edges of the data strobe.
- Sequential & Interleaved Burst type available both for 8 & 4 with BC.
- Multi Purpose Register (MPR) for pre-defined pattern read out
- On Die Termination (ODT) options: Synchronous ODT, Dynamic ODT, and Asynchronous ODT
- Auto Refresh and Self Refresh
- Refresh Interval: 7.8us Tcase < 85°C
Refresh Interval: 3.9us Tcase between 85°C ~ 95°C - RoHS Compliance
