The H2A402G1666C is a high speed Double Date Rate 3 (DDR3) low voltage Synchronous DRAM fabricated with ultra high performance CMOS process containing 2,147,483,648 bits which organized as 16Mbits x 8 banks by 16 bits.
This synchronous device achieves high speed
double-data-rate transfer rates of up to 1866 Mb/sec/pin (DDR3-1866) for general applications.
The chip is designed to comply with the following key DDR3 SDRAM features:
posted CAS with additive latency,
write latency = read latency -1,
On Die Termination,
programmable driver strength data,
seamless BL4 access with bank-grouping.
All of the control and address inputs
are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and /CK falling).
All I/Os are synchronized with a pair of bidirectional differential data strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in
a /RAS and /CAS multiplexing style.
The 2Gb DDR3 devices operates with a single power supply:1.5V±0.075V VDD and VDDQ.