HAA1AG35111S is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced NAND flash device(s) and controller chip assembled as Multi Chip Module. HAA1AG35111S has a standard MMC protocol for easy use.
HAA1AG35111s has the JEDEC/MMCA Version 5.1 interface with either 1-I/O, 4-I/O and 8-I/O mode support. (*) MMCA Version 5.1 is under discussion in JEDEC
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