H2A404G1666C
4Gb (32Mx8Banksx16) DDR3 SDRAM
The H2A404G1666C is a high speed Double Date Rate 3 (DDR3) Synchronous DRAM fabricated with ultra high performance CMOS process containing 4G bits which organized as 32Mbits x 8 banks by 16 bits.
This synchronous device achieves high speed double-data-rate transfer rates of up to 1866 Mb/sec/pin (DDR3-1866) for general applications.
The chip is designed to comply with the following key DDR3 SDRAM features:
Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional differential data strobes (DQS and /DQS) in a source synchronous fashion.
The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style.
This synchronous device achieves high speed double-data-rate transfer rates of up to 1866 Mb/sec/pin (DDR3-1866) for general applications.
The chip is designed to comply with the following key DDR3 SDRAM features:
- posted CAS with additive latency,
- write latency = read latency -1,
- On Die Termination
- programmable driver strength data,
- seamless BL4 access.
Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional differential data strobes (DQS and /DQS) in a source synchronous fashion.
The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style.
Features
- VDD = VDDQ = 1.5V ± 0.075V (JEDEC Standard Power Supply).
- 8 Internal memory banks (BA0-BA2).
- Differential clock input (CK,/CK).
- Programmable /CAS Latency: 5, 6, 7, 8, 9, 10, 11, 13
- /CAS WRITE Latency (CWL): 5,6,7,8,9
- POSTED CAS ADDITIVE Programmable Additive
Latency (AL): 0, CL-1, CL-2 clock - Programmable Sequential / Interleave Burst Type.
- Programmable Burst Length: 4, 8. Through ZQ pin (RZQ:240 ohm±1%)
- 8n-bit prefetch architecture.
- Output Driver Impedance Control.
- Differential bidirectional data strobe.
- Internal(self) calibration: Internal self calibration.
- OCD Calibration.
- Dynamic ODT (Rtt_Nom & Rtt_WR)
- Auto Self-Refresh
- Self-Refresh Temperature
- RoHS compliance and Halogen free
- Packages: 96-Ball BGA for x16 components