Industrial eMMC Solutions

HAA18G35111I is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced NAND flash device(s) and controller chip assembled as Multi Chip Module. HAA18G35111I has a standard MMC protocol for easy use.

HAA18G35111S is 8GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced NAND flash device(s) and controller chip assembled as Multi Chip Module. HAA18G35111S has a standard MMC protocol for easy use.

HAA1AG35111I is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced NAND flash device(s) and controller chip assembled as Multi Chip Module. HAA1AG35111I has a standard MMC protocol for easy use.

HAA1AG35111S is 16GB density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced NAND flash device(s) and controller chip assembled as Multi Chip Module. HAA1AG35111S has a standard MMC protocol for easy use.

AXEME eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim- ple read and write to memory using MMC protocol v5.1 which is a industry standard.

eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VCC) whereas 1.8V or 3V dual supply voltage (VCCQ) is supported for the MMC controller. AXEME eMMC supports HS400 in order to improve sequential bandwidth, especially sequential read performance.

There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.

The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Axeme NAND flash and achieves optimal performance.

AXEME eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim- ple read and write to memory using MMC protocol v5.1 which is a industry standard.

eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VCC) whereas 1.8V or 3V dual supply voltage (VCCQ) is supported for the MMC controller. AXEME eMMC supports HS400 in order to improve sequential bandwidth, especially sequential read performance.

There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.

The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Axeme NAND flash and achieves optimal performance.

• Compliant with eMMC Specification Ver.4.4, 4.41,4.5,5.0
• Bus mode
  • High-speed eMMC protocol
  • Clock frequency : 0-200MHz.
  • Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
• Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
• Single data rate : up to 200Mbyte/s @ 200MHz
• Dual data rate : up to 400Mbyte/s @ 200MHz
• Operating voltage range :
  • VCCQ = 1.8 V/3.3 V
  • VCC = 3.3 V
• Error free memory access
  • Internal error correction code (ECC) to protect data communication
  • Internal enhanced data management algorithm
  • Solid protection of sudden power failure safe-update operations for data content
• Security
  • Support secure bad block erase commands
  • Enhanced write Protection with permanent and partial protection options
• Quality
  • RoHS compliant (for detailed RoHS declaration, please contact your AXEME representative.)
• Supports Field Firmware Update(FFU)
• Enhanced Device Life time
• Support Pre EOL information
• Optimal Size
• Supports Production State Awareness
• Supports Power Off Notification for Sleep
• Supports HS400
• Temperature range
  • Operation:
    • Industrial1: -40℃~85℃
  • Storage:
    • -40℃~85℃

Note1: the temperature is showing as temperature on surface.

AXEME eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim- ple read and write to memory using MMC protocol v5.1 which is a industry standard.

eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VCC) whereas 1.8V or 3V dual supply voltage (VCCQ) is supported for the MMC controller. AXEME eMMC supports HS400 in order to improve sequential bandwidth, especially sequential read performance.

There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.

The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Axeme NAND flash and achieves optimal performance.

AXEME eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim- ple read and write to memory using MMC protocol v5.1 which is a industry standard.

eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VCC) whereas 1.8V or 3V dual supply voltage (VCCQ) is supported for the MMC controller. AXEME eMMC supports HS400 in order to improve sequential bandwidth, especially sequential read performance.

There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.

The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Axeme NAND flash and achieves optimal performance.

• Compliant with eMMC Specification Ver.4.4, 4.41,4.5,5.0
• Bus mode
  • High-speed eMMC protocol
  • Clock frequency : 0-200MHz.
  • Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
• Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
• Single data rate : up to 200Mbyte/s @ 200MHz
• Dual data rate : up to 400Mbyte/s @ 200MHz
• Operating voltage range :
  • VCCQ = 1.8 V/3.3 V
  • VCC = 3.3 V
• Error free memory access
  • Internal error correction code (ECC) to protect data communication
  • Internal enhanced data management algorithm
  • Solid protection of sudden power failure safe-update operations for data content
• Security
  • Support secure bad block erase commands
  • Enhanced write Protection with permanent and partial protection options
• Quality
  • RoHS compliant (for detailed RoHS declaration, please contact your AXEME representative.)
• Supports Field Firmware Update(FFU)
• Enhanced Device Life time
• Support Pre EOL information
• Optimal Size
• Supports Production State Awareness
• Supports Power Off Notification for Sleep
• Supports HS400
• Temperature range
  • Operation:
    • Industrial1: -40℃~85℃
  • Storage:
    • -40℃~85℃

Note1: the temperature is showing as temperature on surface.

• Compliant with eMMC Specification Ver.4.4, 4.41,4.5,5.0
• Bus mode
  • High-speed eMMC protocol
  • Clock frequency : 0-200MHz.
  • Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
• Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
• Single data rate : up to 200Mbyte/s @ 200MHz
• Dual data rate : up to 400Mbyte/s @ 200MHz
• Operating voltage range :
  • VCCQ = 1.8 V/3.3 V
  • VCC = 3.3 V
• Error free memory access
  • Internal error correction code (ECC) to protect data communication
  • Internal enhanced data management algorithm
  • Solid protection of sudden power failure safe-update operations for data content
• Security
  • Support secure bad block erase commands
  • Enhanced write Protection with permanent and partial protection options
• Quality
  • RoHS compliant (for detailed RoHS declaration, please contact your AXEME representative.)
• Supports Field Firmware Update(FFU)
• Enhanced Device Life time
• Support Pre EOL information
• Optimal Size
• Supports Production State Awareness
• Supports Power Off Notification for Sleep
• Supports HS400
• Temperature range
  • Operation:
    • Industrial1: -40℃~85℃
  • Storage:
    • -40℃~85℃

Note1: the temperature is showing as temperature on surface.

AXEME eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim- ple read and write to memory using MMC protocol v5.1 which is a industry standard.

eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VCC) whereas 1.8V or 3V dual supply voltage (VCCQ) is supported for the MMC controller. AXEME eMMC supports HS400 in order to improve sequential bandwidth, especially sequential read performance.

There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.

The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Axeme NAND flash and achieves optimal performance.

AXEME eMMC is an embedded MMC solution designed in a BGA package form. eMMC operation is identical to a MMC device and therefore is a sim- ple read and write to memory using MMC protocol v5.1 which is a industry standard.

eMMC consists of NAND flash and a MMC controller. 3V supply voltage is required for the NAND area (VCC) whereas 1.8V or 3V dual supply voltage (VCCQ) is supported for the MMC controller. AXEME eMMC supports HS400 in order to improve sequential bandwidth, especially sequential read performance.

There are several advantages of using eMMC. It is easy to use as the MMC interface allows easy integration with any microprocessor with MMC host. Any revision or amendment of NAND is invisible to the host as the embedded MMC controller insulates NAND technology from the host. This leads to faster product development as well as faster times to market.

The embedded flash management software or FTL(Flash Transition Layer) of eMMC manages Wear Leveling, Bad Block Management and ECC. The FTL supports all features of the Axeme NAND flash and achieves optimal performance.

• Compliant with eMMC Specification Ver.4.4, 4.41,4.5,5.0
• Bus mode
  • High-speed eMMC protocol
  • Clock frequency : 0-200MHz.
  • Ten-wire bus (clock, 1 bit command, 8 bit data bus) and a hardware reset.
• Supports three different data bus widths : 1 bit(default), 4 bits, 8 bits
• Data transfer rate: up to 52Mbyte/s (using 8 parallel data lines at 52 MHz)
• Single data rate : up to 200Mbyte/s @ 200MHz
• Dual data rate : up to 400Mbyte/s @ 200MHz
• Operating voltage range :
  • VCCQ = 1.8 V/3.3 V
  • VCC = 3.3 V
• Error free memory access
  • Internal error correction code (ECC) to protect data communication
  • Internal enhanced data management algorithm
  • Solid protection of sudden power failure safe-update operations for data content
• Security
  • Support secure bad block erase commands
  • Enhanced write Protection with permanent and partial protection options
• Quality
  • RoHS compliant (for detailed RoHS declaration, please contact your AXEME representative.)
• Supports Field Firmware Update(FFU)
• Enhanced Device Life time
• Support Pre EOL information
• Optimal Size
• Supports Production State Awareness
• Supports Power Off Notification for Sleep
• Supports HS400
• Temperature range
  • Operation:
    • Industrial1: -40℃~85℃
  • Storage:
    • -40℃~85℃

Note1: the temperature is showing as temperature on surface.