Quality DDR2 SDRAM Manufacturer

The H2A35121656B is a high speed Double Date Rate 2 (DDR2) Synchronous DRAM fabricated with ultra high performance CMOS process containing 536,870,912 bits which organized as 8Mbits x 4 banks by 16 bits. This synchronous device achieves high speed double-data-rate transfer rates of up to 1066 Mb/sec/pin (DDR2-1066) for general applications.

The chip is designed to comply with the following key DDR2 SDRAM features:

1. posted CAS with additive latency,
2. write latency = read latency -1,
3. Off-Chip Driver (OCD) impedance adjustment and On Die Termination
4. normal and weak strength data output driver.

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and /CK falling).
All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 512 Mb DDR2 devices operate with a single power supply: 1.8V ± 0.1V VDD and VDDQ.
Available package:TFBGA-84Ball.

The H2A35121656I is a four bank DDR DRAM organized as 4 banks x 16Mbit x 8 . The H2A35121656I achieves high speed data transfer rates by employing a chip architecture that prefetches multiple bits and then synchronizes the output data to a system clock.

The chip is designed to comply with the following key DDR2 SDRAM features:

1. posted CAS with additive latency,
2. write latency = read latency -1,
3. On Die Termination.

All of the control, address, circuits are synchronized with the positive edge of an externally supplied clock. I/O s are synchronized with a pair of bidirectional strobes (DQS, DQS) in a source synchronous fashion.
Operating the four memory banks in an interleaved fashion allows random access operation to occur at a higher rate than is possible with standard DRAMs. A sequential and gapless data rate is possible depending on burst length, CAS latency and speed grade of the device.

The H2A35120856B is a 512M bits DDR2 SDRAM, organized as 16,777,216 words x 4 banks x 8 bits.
This device achieves high speed transfer rates up to 800Mb/sec/pin (DDR2-800) for general applications. All of the control and address inputs are synchronized with a pair of externally supplied differential clocks.
Inputs are latched at the cross point of differential clocks (CLK rising and /CLK falling). All I/Os are synchronized with a single ended DQS or differential DQS- /DQS pair in a source synchronous fashion.

The H2A301G1656B is a high speed Double Date Rate 2 (DDR2) Synchronous DRAM fabricated with ultra high performance CMOS process containing 1,073,741,824 bits which organized as 8Mbits x 8 banks by 16 bits. This synchronous device achieves high speed double-data-rate transfer rates of up to 800Mb/sec/pin (DDR2-1066) for general applications.

The chip is designed to comply with the following key DDR2 SDRAM features:

1. posted CAS with additive latency,
2. write latency = read latency -1,
3. Off-Chip Driver (OCD) impedance adjustment and On Die Termination
4. normal and weak strength data output driver.

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 1Gb DDR2 device operates with a single power supply: 1.8V ± 0.1V VDD and VDDQ. Available package: TFBGA-84Ball (with 0.8mm x 0.8mm ball pitch)

The H2A301G1656C is a high speed Double Date Rate 2 (DDR2) Synchronous DRAM fabricated with ultra high performance CMOS process containing 1G bits which organized as 8Mbits x 8 banks by 16 bits.
This synchronous device achieves high speed double-data-rate transfer rates of up to 1066 Mb/sec/pin (DDR2-1066) for general applications.

The chip is designed to comply with the following key DDR2 SDRAM features:

1. posted CAS with additive latency
2. write latency = read latency -1
3. Off-Chip Driver (OCD) impedance adjustment and On Die Termination
4. normal and weak strength data output driver

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks.
Inputs are latched at the cross point of differential clocks (CK rising and /CK falling).
All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion.
The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style.
The 1Gb DDR2 devices operate with a single power supply: 1.8V ± 0.1V VDD and VDDQ. Available package: TFBGA-84Ball.

The H2A301G0856B is a high speed Double Date Rate 2 (DDR2) Synchronous DRAM fabricated with ultra high performance CMOS process containing 1G bits which organized as 16Mbits x 8 banks by 8 bits.
This synchronous device achieves high speed double-data-rate transfer rates of up to 1066 Mb/sec/pin (DDR2-1066) for general applications.

The chip is designed to comply with the following key DDR2 SDRAM features:

1. posted CAS with additive latency,
2. write latency = read latency -1,
3. Off-Chip Driver (OCD) impedance adjustment and On Die Termination
4. normal and weak strength data output driver.

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 1Gb DDR2 devices operate with a single power supply: 1.8V ± 0.1V VDD and VDDQ.
Available package: TFBGA-60Ball.

The H2A302G1656B is a high speed Double Date Rate 2 (DDR2) Synchronous DRAM fabricated with ultra high performance CMOS process containing 2G bits which organized as 16Mbits x 8 banks by 16 bits.
This synchronous device achieves high speed double-data-rate transfer rates of up to 1066 Mb/sec/pin (DDR2-1066) for general applications.

The chip is designed to comply with the following key DDR2 SDRAM features:

1. posted CAS with additive latency,
2. write latency = read latency -1,
3. Off-Chip Driver (OCD) impedance adjustment and On Die Termination
4. normal and weak strength data output driver.

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style.
The 2Gb DDR2 devices operate with a single power supply: 1.8V ± 0.1V VDD and VDDQ.
Available package: TFBGA-84Ball.

The H2A302G0856B is a high speed Double Date Rate 2 (DDR2) Synchronous DRAM fabricated with ultra high performance CMOS process containing 2G bits which organized as 32Mbits x 8 banks by 8 bits.
This synchronous device achieves high speed double-data-rate transfer rates of up to 1066 Mb/sec/pin (DDR2-1066) for general applications.

The chip is designed to comply with the following key DDR2 SDRAM features:

1. posted CAS with additive latency,
2. write latency = read latency -1,
3. Off-Chip Driver (OCD) impedance adjustment and On Die Termination
4. normal and weak strength data output driver.

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks.
Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style. The 2Gb DDR2 devices operate with a single power supply: 1.8V ± 0.1V VDD and VDDQ.
Available package: TFBGA-60Ball.

The H2A302G1656C is a high speed Double Date Rate 2 (DDR2) Synchronous DRAM fabricated with ultra high performance CMOS process containing 2G bits which organized as 16Mbits x 8 banks by 16 bits. This synchronous device achieves high speed double-data-rate transfer rates of up to 1066 Mb/sec/pin (DDR2-1066) for general applications.

The chip is designed to comply with the following key DDR2 SDRAM features:

1. posted CAS with additive latency
2. write latency = read latency -1
3. Off-Chip Driver (OCD) impedance adjustment and On Die Termination
4. normal and weak strength data output driver.

All of the control and address inputs are synchronized with a pair of externally supplied differential clocks.
Inputs are latched at the cross point of differential clocks (CK rising and /CK falling). All I/Os are synchronized with a pair of bidirectional strobes (DQS and /DQS) in a source synchronous fashion. The address bus is used to convey row, column and bank address information in a /RAS and /CAS multiplexing style.